Tongxin Microelectronics (TMC), a leading provider of chip and security solutions, showcased its latest advancements at the Seamless Middle East Fintech 2025 conference in Dubai. The company introduced a range of secure chips designed for digital banking, payment systems, and identity verification, aiming to enhance cybersecurity in the region’s rapidly evolving fintech landscape. TMC’s participation underscores its commitment to supporting the Middle East’s digital transformation by providing robust security infrastructure for financial institutions and government agencies.
Source: Kalkine Media
